Applied Materials, Inc. introduced a technology that removes a critical bottleneck to continued 2D scaling in foundry-logic nodes.   Applied’s new Selective Tungsten process technology gives chipmakers a new way to build transistor contacts, which are the crucial, first level of wiring that connects the transistor to the rest of the wiring in the chip.   The selective deposition innovation lowers contact resistance which impedes transistor performance and increases power consumption. Wit...